english
中文
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General PCB Capabilities
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HLC
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HDI
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FPC&Rigid-Flex
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IMS PCB
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Layer Count
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1-24
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4-24
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FPC:1-8
Rigid-Flex:2-14 |
1-2
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Board Thickness(mm)
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0.3-3.4
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0.27-3.4
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FPC:0.05-1.0
Rigid-Flex：0.27-3.2 |
Typical:1.6 (63) Max.:3.2 (126) Min.: 0.8 (32)
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Min.Dielectric Thickness(mm)
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0.05
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0.05
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0.05
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0.05
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Max.Panel Size(mm×mm)
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724 (28.5") x 622 (24.5")
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610 (24")×475（18.7"）
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FPC: 250 (19.7") x 550(21.6") Rigid: 500(19.7")×600(23.6")
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520(20.5") x 610 (24.0")
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Base Copper Thickness(oz)
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1/3-6
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1/3-4
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FPC:1/3-2
Rigid-Flex:1/3-4 |
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Hole-wall Copper Thickness(µm)
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20-70
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20/18, 25/20
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20/25
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20/25
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Outer Layer Finished Copper Thickness(oz)
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1-5
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1-2
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1-2
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1-2
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Laminate Supplier
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Rogers，Panasonic，Nelco，TUC，Isola，ITEQ，SYTECH，Nanya，Taconic、EMC、DOOSAN、Wazam、CCTC，NOUYA, KB
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SYTECH，TAIFLEX，ThinFlex
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Wazam，Ventec，ITEQ，SYTECH，RISHO
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Laminate Type
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CME-1, CEM-3, High-CTI，Unleaded（Mid、High-Tg），Halogen Free，High frequency（hydrocarbon、PTFE），High Speed（mid. loss、low loss、very low loss，ultra low loss）, PI, MPI, LCP
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Copper Base，Aluminum Base
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Min.line width/space (inner layer)(mm)
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0.05/0.05
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0.05/0.05
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FPC:0.04/0.04
Rigid-Flex:0.05/0.05 |
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Min.line width/space (outer layer)(mm)
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0.05/0.05
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0.05/0.05
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FPC:0.045/0.045
Rigid-Flex:0.05/0.05 |
0.10/0.10
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Line width tolerance(mm)
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+/-20%(Typical) +/-10%(Advanced)
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+/-20%(Typical) +/-10%(Advanced)
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+/-20%(Typical) +/-10%(Advanced)
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+/-20%(Typical) +/-10%(Advanced)
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Layer to layer registration(mil)
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5
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5
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5
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5
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Impedance(%)
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8
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8
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8
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Mechanical drill diameter(mm)
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≥0.15
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≥0.15
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≥0.15
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1-6
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Laser hole diameter(mm)
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≥0.075
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≥0.075
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≥0.075
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Max.Aspect ratio (PTH)
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12:1
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12:1
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12:1
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4:1
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Max.Aspect ratio (Microvia)
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1:1
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1:1
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Backdrill depth tolerance(mil)
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±3
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±3
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±3
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±4
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Max.Warpage(%)
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0.40
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0.40
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0.40
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0.50
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Signal Integrity
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SET2DIL/Delta-L/VNA
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Surface Finish
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HASL-LF，HASL，Electroless Nickel/Immersion Gold，Immersion Tin，OSP，Immersion Silver，Gold Finger，Selective OSP
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HASL-LF，Electroless Nickel/Immersion Gold，OSP
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Structure
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Through hole
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5+N+5
Anylayer |
Common Symmetrical structure，Symmetrical structure HDI
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Air-gap Structure
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Asymmetric structure，HDI
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Special Product
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Embedded PCB
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Embedded parallel capacitor、Embedded daughter board
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Stepped PCB
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PTH slot，NPTH slot，Stepped G/F., ect.
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Heat dissipation PCB
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IMS，Embedded Cu，Embedded Coin、Embedded Ceramic、Conductive Adhesive、High Thermal Dissipation Material, Heat Sink Paste ., ect.
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High density PCB
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1mm pitch BGA with backdrill (2 tracks)，8mil PTH with backdrill (D+6mil)，0.35mm pitch BGA HDI., ect.
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Other Special Process
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POFV(VIPPO ), Hybrid, Partial Hybrid, Variable Length G/F, Stepped G/F, Segmented G/F, Edge Plating, N+N, Partial Plating，Semi-flex., ect.
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